A wide variety of films have been deposited using plasma enhanced atomic layer deposition. Film analysis is required to quantify the quality of a deposition process. Most films are characterized for thickness to determine growth per cycle. Film composition measurements including impurity concentration and stoichiometry are also common for all classes of films. Dielectric materials are often analylzed for permittivity, leakage current, and breakdown voltage. Conductive materials are often characterized by their resistivity/sheet resistance. Other properties may be characterized depending on whether the film will be utilized for other characteristics such as optical, electrical, mechanical, or diffusion barrier. The extensive list of film characteristics discussed in the literature reveals the broad range of applications researchers have sought for plasma enhanced atomic layer deposition films.
Below is a table which lists all the film characteristics which have been discussed in the publications included in the plasma-ald.com database. Click on the film characteristic to get a list of relevant publications.
I am sure there are papers I have not found. I am sure there is an occasional typo or omission in the database entries. I have hundreds of pre-2009 papers yet to add. As a result, the information provided is not perfect and not complete. Don't blame Plasma-ALD-Guy if the use of information on this site does not work out for you. If you know of publications I have missed or a database entry is wrong, send me an email at: firstname.lastname@example.org
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