Highly-Conformal Amorphous W-Si-N Thin Films by Plasma Enhanced Atomic Layer Deposition as a Diffusion Barrier for Cu Metallization

Type:
Journal
Info:
J. Phys. Chem. C, 2015, 119 (3), pp 1548-1556
Date:
2014-12-29

Author Information

Name Institution
Soo-Hyun KimYenunnam University

Films


Film/Plasma Properties

Substrates

Notes

228