Low Temperature Plasma-Enhanced Atomic Layer Deposition of Metal Oxide Thin Films

Type:
Journal
Info:
Journal of The Electrochemical Society, 157 (7) P66-P74 (2010)
Date:
2010-04-16

Author Information

Name Institution
Stephen E. PottsEindhoven University of Technology
Wytze KeuningEindhoven University of Technology
E. LangereisEindhoven University of Technology
Gijs DingemansEindhoven University of Technology
Mauritius C. M. (Richard) van de SandenEindhoven University of Technology
Erwin (W.M.M.) KesselsEindhoven University of Technology

Films

Plasma Al2O3


Plasma Al2O3


Thermal Al2O3


Thermal Al2O3


Plasma TiO2


Plasma TiO2



Plasma Ta2O5


Film/Plasma Properties

Characteristic: Thickness
Analysis: Ellipsometry

Characteristic: Density
Analysis: Ellipsometry

Characteristic: Density
Analysis: RBS, Rutherford Backscattering Spectrometry

Characteristic: Chemical Composition, Impurities
Analysis: RBS, Rutherford Backscattering Spectrometry

Characteristic: Chemical Composition, Impurities
Analysis: TOF-ERDA, Time-Of-Flight Elastic Recoil Detection Analysis

Substrates

Si(100)

Notes

709