Atomic Layer Deposition of Ruthenium with TiN Interface for Sub-10 nm Advanced Interconnects beyond Copper

Type:
Journal
Info:
ACS Appl. Mater. Interfaces, 2016, 8 (39), pp 26119-26125
Date:
2016-09-06

Author Information

Name Institution
Liang Gong WenIMEC
Philippe RousselIMEC
Olalla Varela PedreiraIMEC
Basoene BriggsIMEC
Benjamin GrovenIMEC
Shibesh DuttaIMEC
Mihaela I. PopoviciIMEC
Nancy HeylenIMEC
Ivan CiofiIMEC
Kris VanstreelsIMEC
Frederik W. ØsterbergTechnical University of Denmark
Ole HansenTechnical University of Denmark
Dirch H. PetersenTechnical University of Denmark
Karl OpsomerIMEC
Christophe DetavernierGhent University
Christopher J. WilsonIMEC
Sven Van ElshochtIMEC
Kristof CroesIMEC
Jürgen BömmelsIMEC
Zsolt TőkeiIMEC
Christoph AdelmannIMEC

Films

Thermal Ru


Thermal TiN

Hardware used: Unknown


Plasma SiO2

Hardware used: Unknown


Film/Plasma Properties

Substrates

Notes

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