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Effect of Surface Reduction Treatments of Plasma-Enhanced Atomic Layer Chemical Vapor Deposited TaNx on Adhesion with Copper
Type:
Journal
Info:
Journal of The Electrochemical Society, 157 (2) G62-G66 (2010)
Date:
2009-10-01
Author Information
| Name | Institution |
|---|---|
| Chih-Chieh Chang | National Chiao Tung University |
| Fu-Ming Pan | National Chiao Tung University |
| Ching-Wen Chen | National Chiao Tung University |
Films
Film/Plasma Properties
Characteristic: Adhesion
Analysis: Bending Test, Four Point Bend Delamination Test
Characteristic: Adhesion
Analysis: Pull-off tensile test
Characteristic: Morphology, Roughness, Topography
Analysis: SEM, Scanning Electron Microscopy
Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy
Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy
Characteristic: Chemical Composition, Impurities
Analysis: AES, Auger Electron Spectroscopy
Characteristic: Microstructure
Analysis: TEM, Transmission Electron Microscope
Substrates
| SiO2 |
| Si(100) |
Notes
| 722 |