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Plasma Enhanced Atomic Layer Deposition of Al2O3/SiO2 MIM Capacitors
Type:
Journal
Info:
IEEE ELECTRON DEVICE LETTERS, VOL. 36, NO. 5, PP. 496-498, 2015
Date:
2015-03-16
Author Information
| Name | Institution |
|---|---|
| Dustin Zachary Austin | Oregon State University |
| Derryl Allman | Oregon State University |
| David Price | Oregon State University |
| Sallie Hose | Oregon State University |
| John F. Conley, Jr. | Oregon State University |
Films
Plasma Al2O3
Plasma SiO2
Film/Plasma Properties
Characteristic: Thickness
Analysis: TEM, Transmission Electron Microscope
Characteristic: Thickness
Analysis: Ellipsometry
Characteristic: Capacitance
Analysis: C-V, Capacitance-Voltage Measurements
Characteristic: Leakage Current
Analysis: I-V, Current-Voltage Measurements
Substrates
| TaN |
| Al2O3 |
Notes
| 514 |