Remote Plasma and Thermal ALD of Platinum and Platinum Oxide Films

Type:
Presentation
Info:
ALD 2009
Date:
2008-11-03
DOI:
No DOI

Author Information

Name Institution
Harm C. M. KnoopsEindhoven University of Technology
Adriaan J. M. MackusEindhoven University of Technology
Merijn E. DondersEindhoven University of Technology
Mauritius C. M. (Richard) van de SandenEindhoven University of Technology
Peter H. L. NottenEindhoven University of Technology
Erwin (W.M.M.) KesselsEindhoven University of Technology

Films

Plasma Pt


Thermal Pt


Plasma Pt


Plasma PtO2


Film/Plasma Properties

Characteristic: Thickness
Analysis: Ellipsometry

Characteristic: Thickness
Analysis: XRR, X-Ray Reflectivity

Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy

Characteristic: Density
Analysis: XRR, X-Ray Reflectivity

Characteristic: Density
Analysis: RBS, Rutherford Backscattering Spectrometry

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction

Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe

Substrates

Si(100)
SiO2

Notes

Pt and PtO2 process the same except PtO2 has longer O2 plasma step.
Same content as paper in database with similar name.
Showed 16:1 conformal Pt deposition.
Database entry based entirely on presentation pdf. Recorded talk was not reviewed.
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