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Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
Type:
Journal
Info:
Journal of The Electrochemical Society, 156 (9) H734-H739 (2009)
Date:
2009-06-03
Author Information
| Name | Institution |
|---|---|
| Liqi Wu | State University of New York at Albany |
| Eric T. Eisenbraun | State University of New York at Albany |
Films
Plasma Cu
Plasma Ru
Film/Plasma Properties
Characteristic: Chemical Composition, Impurities
Analysis: AES, Auger Electron Spectroscopy
Characteristic: Chemical Composition, Impurities
Analysis: NRA, Nuclear Reaction Analysis
Characteristic: Conformality, Step Coverage
Analysis: SEM, Scanning Electron Microscopy
Characteristic: Conformality, Step Coverage
Analysis: TEM, Transmission Electron Microscope
Characteristic: Microstructure
Analysis: FIB, Focused Ion Beam
Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction
Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe
Characteristic: Adhesion
Analysis: Tape Test
Substrates
| Ru |
| Ta |
| TaN |
| SiO2 |
Notes
| 744 |