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In Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating
Type:
Journal
Info:
Journal of The Electrochemical Society, 158 (4) G97-G102 (2011)
Date:
2010-12-30
Author Information
| Name | Institution |
|---|---|
| Chih-Chieh Chang | National Chiao Tung University |
| Fu-Ming Pan | National Chiao Tung University |
Films
Film/Plasma Properties
Characteristic: Morphology, Roughness, Topography
Analysis: SEM, Scanning Electron Microscopy
Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy
Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy
Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: GIXRD, Grazing Incidence X-Ray Diffraction
Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: TEM, Transmission Electron Microscope
Characteristic: Chemical Composition, Impurities
Analysis: AES, Auger Electron Spectroscopy
Characteristic: Chemical Composition, Impurities
Analysis: SIMS, Secondary Ion Mass Spectrometry
Characteristic: Adhesion
Analysis: Pull-off tensile test
Characteristic: Leakage Current
Analysis: I-V, Current-Voltage Measurements
Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe
Substrates
| SiO2 |
Notes
| 687 |