Challenges in atomic layer deposition of carbon-containing silicon-based dielectrics

Type:
Journal
Info:
Journal of Vacuum Science & Technology A 35, 021506 (2017)
Date:
2016-12-22

Author Information

Name Institution
Rafaiel A. OvanesyanColorado School of Mines
Dennis M. HausmannLam Research Corporation
Sumit AgarwalColorado School of Mines

Films

Plasma SiNx




Plasma SiO2


Plasma SiO2


Film/Plasma Properties

Characteristic: Surface Reactions
Analysis: ATR-FTIR

Substrates

Si3N4
Silicon
SiOxNy

Notes

848