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Publication Information

Title: The Properties of Cu Thin Films on Ru Depending on the ALD Temperature

Type: Journal

Info: Journal of Nanoscience and Nanotechnology, Volume 15, Number 2, pp. 1601-1604

Date: 2015-02-01

DOI: http://dx.doi.org/doi:10.1166/jnn.2015.9286

Author Information

Name

Institution

Sungkyunkwan University

Sungkyunkwan University

Sungkyunkwan University

Sungkyunkwan University

Films

Plasma TaNx using Unknown

Deposition Temperature Range N/A

169896-41-7

1333-74-0

Plasma Ru using Unknown

Deposition Temperature Range N/A

0-0-0

7664-41-7

Film/Plasma Properties

Characteristic

Analysis

Diagnostic

Substrates

SiO2

TaN

Keywords

Diffusion Barrier

Interconnect

Notes

543

Disclaimer

I am sure there are papers I have not found. I am sure there is an occasional typo or omission in the database entries. I have hundreds of pre-2009 papers yet to add. As a result, the information provided is not perfect and not complete. Don't blame Plasma-ALD-Guy if the use of information on this site does not work out for you. If you know of publications I have missed or a database entry is wrong, send me an email at: plasma-ald-guy@plasma-ald.com

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