Plasma-Enhanced Atomic Layer Deposition (PEALD) of TiN using the Organic Precursor Tetrakis(ethylmethylamido)Titanium (TEMAT)

Type:
Conference Proceedings
Info:
2015 2nd International Conference on Chemical and Material Engineering (ICCME 2015)
Date:
2015-12-27

Author Information

Name Institution
Z.X. ChenA*STAR (Agency for Science, Technology and Research)
X. (Picosun Asia) LiPicosun Asia
W.-M. LiPicosun Asia
G.-Q. LoA*STAR (Agency for Science, Technology and Research)

Films


Film/Plasma Properties

Characteristic: Thickness
Analysis: -

Characteristic: Resistivity, Sheet Resistance
Analysis: -

Characteristic: Chemical Composition, Impurities
Analysis: -

Characteristic: Density
Analysis: -

Characteristic: Images
Analysis: TEM, Transmission Electron Microscope

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: Electron Diffraction

Characteristic: Conformality, Step Coverage
Analysis: TEM, Transmission Electron Microscope

Substrates

Silicon

Notes

480