Diffusion Barrier Properties Plasma Enhanced Atomic Layer Deposition Publications

Your search for plasma enhanced atomic layer deposition publications discussing Diffusion Barrier Properties returned 41 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
2Integration of plasmonic Ag nanoparticles as a back reflector in ultra-thin Cu(In,Ga)Se2 solar cells
3Plasma-assisted ALD to functionalize PET: towards new generation flexible gadgets
4Characteristics of Plasma-Enhanced Atomic Layer Deposited RuSiN as a Diffusion Barrier against Cu
5Plasma-Enhanced ALD of Titanium-Silicon-Nitride Using TiCl4 , SiH4, and N2/H2/Ar Plasma
6Development of Manufacturable Solutions for the Direct Plating of Copper on Robust ALD-Grown Barriers
7Diffusion barrier properties of TaNx films prepared by plasma enhanced atomic layer deposition from PDMAT with N2 or NH3 plasma
8Moisture barrier and chemical corrosion protection of silver-based telescope mirrors using aluminum oxide films by plasma-enhanced atomic layer deposition
9Growth mechanism and diffusion barrier property of plasma-enhanced atomic layer deposition Ti-Si-N thin films
10From Precursor Chemistry to Gas Sensors: Plasma-Enhanced Atomic Layer Deposition Process Engineering for Zinc Oxide Layers from a Nonpyrophoric Zinc Precursor for Gas Barrier and Sensor Applications
11Dielectric barrier characteristics of Si-rich silicon nitride films deposited by plasma enhanced atomic layer deposition
12Atomic layer deposition of amorphous Ni-Ta-N films for Cu diffusion barrier
13Deposition of Al2O3 by Using ECR-ALD for Organic Substrate Devices
14Effects of NH3 pulse plasma on atomic layer deposition of tungsten nitride diffusion barrier
15Characterization of Ultrathin PEALD-Grown RuCo Films for Diffusion Barrier and Copper Direct-Plate Applications
16Growth Kinetics and Crystallization Behavior of TiO2 Films Prepared by Plasma Enhanced Atomic Layer Deposition
17Plasma-enhanced atomic layer deposition of amorphous Ru-Si-N thin film as a diffusion barrier of direct plating of Cu
18Low temperature plasma-enhanced atomic layer deposition of thin vanadium nitride layers for copper diffusion barriers
19Diffusion barrier properties of transition metal thin films grown by plasma-enhanced atomic-layer deposition
20Plasma-enhanced atomic layer deposition of TiCx films using tetrakis neopentyl titanium and applications to a diffusion barrier and contact material
21Properties of plasma-enhanced atomic layer deposited TiCx films as a diffusion barrier for Cu metallization
22Atomic layer deposition of WNx thin films using a F-free tungsten metal-organic precursor and NH3 plasma as a Cu-diffusion barrier
23A New Pulse Plasma Enhanced Atomic Layer Deposition of Tungsten Nitride Diffusion Barrier for Copper Interconnect
24An efficient PE-ALD process for TiO2 thin films employing a new Ti-precursor
25Atomic layer deposited Al2O3 and parylene C dual-layer encapsulation for biomedical implantable devices
26Nanometer-Thick Conformal Pore Sealing of Self-Assembled Mesoporous Silica by Plasma-Assisted Atomic Layer Deposition
27Characteristics of WNxCy films deposited using remote plasma atomic layer deposition with (MeCp)W(CO)2(NO) for Cu diffusion barrier
28Ru thin film grown on TaN by plasma enhanced atomic layer deposition
29Atomic layer deposition of titanium nitride from TDMAT precursor
30Robust TaNx diffusion barrier for Cu-interconnect technology with subnanometer thickness by metal-organic plasma-enhanced atomic layer deposition
31Plasma-enhanced atomic layer deposition of tantalum nitride thin films using tertiary-amylimido-tris(dimethylamido)tantalum and hydrogen plasma
32Remote plasma enhanced atomic layer deposition of TiN thin films using metalorganic precursor
33Effect of an Al2O3/TiO2 Passivation Layer on the Performance of Amorphous Zinc-Tin Oxide Thin-Film Transistors
34Method to enhance atomic-layer deposition of tungsten-nitride diffusion barrier for Cu interconnect
35Plasma Enhanced Atomic Layer Deposition of TaN Films for Advanced Interconnects
36Improvement of Copper Diffusion Barrier Properties of Tantalum Nitride Films by Incorporating Ruthenium Using PEALD
37Biosensor properties of SOI nanowire transistors with a PEALD Al2O3 dielectric protective layer
38The Growth of Tantalum Thin Films by Plasma-Enhanced Atomic Layer Deposition and Diffusion Barrier Properties
39Atomic layer deposited nanocrystalline tungsten carbides thin films as a metal gate and diffusion barrier for Cu metallization
40TaCN growth with PDMAT and H2/Ar plasma by plasma enhanced atomic layer deposition
41The physical properties of cubic plasma-enhanced atomic layer deposition TaN films