Diffusion Barrier Properties Plasma Enhanced Atomic Layer Deposition Publications

Your search for plasma enhanced atomic layer deposition publications discussing Diffusion Barrier Properties returned 24 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

1A New Pulse Plasma Enhanced Atomic Layer Deposition of Tungsten Nitride Diffusion Barrier for Copper Interconnect
2An efficient PE-ALD process for TiO2 thin films employing a new Ti-precursor
3Atomic layer deposited Al2O3 and parylene C dual-layer encapsulation for biomedical implantable devices
4Atomic layer deposited nanocrystalline tungsten carbides thin films as a metal gate and diffusion barrier for Cu metallization
5Atomic layer deposition of titanium nitride from TDMAT precursor
6Biosensor properties of SOI nanowire transistors with a PEALD Al2O3 dielectric protective layer
7Characteristics of WNxCy films deposited using remote plasma atomic layer deposition with (MeCp)W(CO)2(NO) for Cu diffusion barrier
8Deposition of Al2O3 by Using ECR-ALD for Organic Substrate Devices
9Dielectric barrier characteristics of Si-rich silicon nitride films deposited by plasma enhanced atomic layer deposition
10Effect of an Al2O3/TiO2 Passivation Layer on the Performance of Amorphous Zinc-Tin Oxide Thin-Film Transistors
11Effects of NH3 pulse plasma on atomic layer deposition of tungsten nitride diffusion barrier
12Integration of plasmonic Ag nanoparticles as a back reflector in ultra-thin Cu(In,Ga)Se2 solar cells
13Low temperature plasma-enhanced atomic layer deposition of thin vanadium nitride layers for copper diffusion barriers
14Method to enhance atomic-layer deposition of tungsten-nitride diffusion barrier for Cu interconnect
15Moisture barrier and chemical corrosion protection of silver-based telescope mirrors using aluminum oxide films by plasma-enhanced atomic layer deposition
16Plasma Enhanced Atomic Layer Deposition of TaN Films for Advanced Interconnects
17Plasma-Enhanced ALD of Titanium-Silicon-Nitride Using TiCl4 , SiH4, and N2/H2/Ar Plasma
18Plasma-enhanced atomic layer deposition of amorphous Ru-Si-N thin film as a diffusion barrier of direct plating of Cu
19Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
20Plasma-enhanced atomic layer deposition of tantalum nitride thin films using tertiary-amylimido-tris(dimethylamido)tantalum and hydrogen plasma
21Plasma-enhanced atomic layer deposition of TiCx films using tetrakis neopentyl titanium and applications to a diffusion barrier and contact material
22Properties of plasma-enhanced atomic layer deposited TiCx films as a diffusion barrier for Cu metallization
23Remote plasma enhanced atomic layer deposition of TiN thin films using metalorganic precursor
24Ru thin film grown on TaN by plasma enhanced atomic layer deposition


I am sure there are papers I have not found. I am sure there is an occasional typo or omission in the database entries. I have hundreds of pre-2009 papers yet to add. As a result, the information provided is not perfect and not complete. Don't blame Plasma-ALD-Guy if the use of information on this site does not work out for you. If you know of publications I have missed or a database entry is wrong, send me an email at: plasma-ald-guy@plasma-ald.com

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