Bis(EthylCycloPentadienyl)Ruthenium, Ru(EtCp)2, CAS# 32992-96-4

Where to buy

NumberVendorRegionLink
1GelestπŸ‡ΊπŸ‡ΈDiethylruthenocene
2Strem Chemicals, Inc.πŸ‡ΊπŸ‡ΈBis(ethylcyclopentadienyl)ruthenium(II), 98% (99.9%-Ru), contained in 50 ml cylinder for CVD/ALD
3Strem Chemicals, Inc.πŸ‡ΊπŸ‡ΈBis(ethylcyclopentadienyl)ruthenium(II), 98% (99.9%-Ru), contained in 50 ml cylinder with high temperature valve for CVD/ALD
4Strem Chemicals, Inc.πŸ‡ΊπŸ‡ΈBis(ethylcyclopentadienyl)ruthenium(II), 98% (99.9%-Ru)
5DOCK/CHEMICALSπŸ‡©πŸ‡ͺBis(ethylcyclopentadienyl)ruthenium
6Pegasus ChemicalsπŸ‡¬πŸ‡§Bis(ethylcyclopentadienyl)ruthenium

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Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for publications using this chemistry returned 37 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1In Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating
2Solid Electrolyte Lithium Phosphous Oxynitride as a Protective Nanocladding Layer for 3D High-Capacity Conversion Electrodes
3Ru thin film grown on TaN by plasma enhanced atomic layer deposition
4Correlation of carbon content with the thermal stability of ruthenium deposited by using RF-direct plasma-enhanced atomic-layer deposition
5Comparison of PVD, PECVD & PEALD Ru(-C) films as Cu diffusion barriers by means of bias temperature stress measurements
6Effects of Ar plasma treatment for deposition of ruthenium film by remote plasma atomic layer deposition
7Reliability testing of high aspect ratio through silicon vias fabricated with atomic layer deposition barrier, seed layer and direct plating and material properties characterization of electrografted insulator, barrier and seed layer for 3-D integration
8(Invited) Characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 Capacitors
9A Bilayer Diffusion Barrier of ALD-Ru/ALD-TaCN for Direct Plating of Cu
10Thermal and plasma enhanced atomic layer deposition ruthenium and electrical characterization as a metal electrode
11Texture of atomic layer deposited ruthenium
12Atomic layer deposition of RuO2 thin films on SiO2 using Ru(EtCp)2 and O2 plasma
13Improved Oxygen Diffusion Barrier Properties of Ruthenium-Titanium Nitride Thin Films Prepared by Plasma-Enhanced Atomic Layer Deposition
14ALD ruthenium oxide-carbon nanotube electrodes for supercapacitor applications
15Improvement of smooth surface of RuO2 bottom electrode on Al2O3 buffer layer and characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 capacitors
16Improvement of the thermal stability of nickel silicide using a ruthenium interlayer deposited via remote plasma atomic layer deposition
17Enhanced Dielectric Properties of SrTiO3 Films with a SrRuO3 Seed by Plasma-Enhanced Atomic Layer Deposition
18Structure of Ru/Pt Nanocomposite Films Fabricated by Plasma-Enhanced Atomic Layer Depositions
19Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
20Improvement of smooth surface of RuO2 bottom electrode on Al2O3 buffer layer and characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 capacitors
21The properties of Ru films deposited by remote plasma atomic layer deposition on Ar plasma-treated SiO2
22Improvement of Copper Diffusion Barrier Properties of Tantalum Nitride Films by Incorporating Ruthenium Using PEALD
23Temperature controlled Ru and RuO2 growth via O* radical-enhanced atomic layer deposition with Ru(EtCp)2
24Temperature controlled Ru and RuO2 growth via O* radical-enhanced atomic layer deposition with Ru(EtCp)2
25Plasma-Enhanced Atomic Layer Deposition of Ruthenium Thin Films
26Preparation of Ru thin film layer on Si and TaN/Si as diffusion barrier by plasma enhanced atomic layer deposition
27Structural investigation of Ru/Pt nanocomposite films prepared by plasma-enhanced atomic layer depositions
28In Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating
29Initial and steady-state Ru growth by atomic layer deposition studied by in situ Angle Resolved X-ray Photoelectron Spectroscopy
30Ru Thin Film Formation Using Oxygen Plasma Enhanced ALD and Rapid Thermal Processing
31PEALD of a Ruthenium Adhesion Layer for Copper Interconnects
32Effect of annealing conditions on formation of SrRuO3 films by interfacial reaction of SrO/RuO2 bi-layer films
33Atomic Layer Deposition of Ru Nanocrystals with a Tunable Density and Size for Charge Storage Memory Device Application
34Formation of Ru nanocrystals by plasma enhanced atomic layer deposition for nonvolatile memory applications
35Atomic Layer Deposition of Ruthenium and Ruthenium-oxide Thin Films by Using a Ru(EtCp)2 Precursor and Oxygen Gas
36Initial Stages of Ruthenium Film Growth in Plasma-Enhanced Atomic Layer Deposition
37Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals