Ru Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for plasma enhanced atomic layer deposition publications discussing Ru films returned 29 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1Atomic layer deposited self-forming Ru-Mn diffusion barrier for seedless Cu interconnects
2Atomic layer deposition of Ru from CpRu(CO)2Et using O2 gas and O2 plasma
3Atomic Layer Deposition of Ru Thin Films Using a New Beta-Diketonate Ru Precursor and NH3 Plasma as a Reactant
4Atomic Layer Deposition of Ruthenium and Ruthenium-oxide Thin Films by Using a Ru(EtCp)2 Precursor and Oxygen Gas
5Atomic Layer Deposition of Ruthenium with TiN Interface for Sub-10 nm Advanced Interconnects beyond Copper
6Correlation of carbon content with the thermal stability of ruthenium deposited by using RF-direct plasma-enhanced atomic-layer deposition
7Development of plasma-enhanced atomic layer deposition grown Ru-WCN mixed phase films for nanoscale diffusion barrier and copper direct-plate applications
8Effects of Ar plasma treatment for deposition of ruthenium film by remote plasma atomic layer deposition
9Improvement of the thermal stability of nickel silicide using a ruthenium interlayer deposited via remote plasma atomic layer deposition
10In situ spectroscopic ellipsometry during atomic layer deposition of Pt, Ru and Pd
11In Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating
12Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
13Mobile setup for synchrotron based in situ characterization during thermal and plasma-enhanced atomic layer deposition
14Near room temperature plasma enhanced atomic layer deposition of ruthenium using the RuO4-precursor and H2-plasma
15Non-destructive acoustic metrology and void detection in 3x50μm TSV
16PEALD of a Ruthenium Adhesion Layer for Copper Interconnects
17Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
18Potassium Permanganate-Based Slurry to Reduce the Galvanic Corrosion of the Cu/Ru/TiN Barrier Liner Stack during CMP in the BEOL Interconnects
19Preparation of Ru thin film layer on Si and TaN/Si as diffusion barrier by plasma enhanced atomic layer deposition
20Radical Enhanced Atomic Layer Deposition of Metals and Oxides
21Reliability testing of high aspect ratio through silicon vias fabricated with atomic layer deposition barrier, seed layer and direct plating and material properties characterization of electrografted insulator, barrier and seed layer for 3-D integration
22Ru thin film grown on TaN by plasma enhanced atomic layer deposition
23Scalability of plasma enhanced atomic layer deposited ruthenium films for interconnect applications
24Structural investigation of Ru/Pt nanocomposite films prepared by plasma-enhanced atomic layer depositions
25Structure of Ru/Pt Nanocomposite Films Fabricated by Plasma-Enhanced Atomic Layer Depositions
26The Properties of Cu Thin Films on Ru Depending on the ALD Temperature
27The properties of Ru films deposited by remote plasma atomic layer deposition on Ar plasma-treated SiO2
28Thermal and plasma enhanced atomic layer deposition ruthenium and electrical characterization as a metal electrode
29Understanding the EOT-Jg degradation in Ru/SrTiOx/Ru metal-insulator-metal capacitors formed with Ru atomic layer deposition

Disclaimer

I am sure there are papers I have not found. I am sure there is an occasional typo or omission in the database entries. I have hundreds of pre-2009 papers yet to add. As a result, the information provided is not perfect and not complete. Don't blame Plasma-ALD-Guy if the use of information on this site does not work out for you. If you know of publications I have missed or a database entry is wrong, send me an email at: plasma-ald-guy@plasma-ald.com

Follow plasma-ald.com

Follow @PlasmaALDGuy Tweet

Shortcuts



© 2014-2017 plasma-ald.com