Ru Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for plasma enhanced atomic layer deposition publications discussing Ru films returned 30 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1Atomic layer deposited self-forming Ru-Mn diffusion barrier for seedless Cu interconnects
2Atomic layer deposition of Ru from CpRu(CO)2Et using O2 gas and O2 plasma
3Atomic Layer Deposition of Ru Thin Films Using a New Beta-Diketonate Ru Precursor and NH3 Plasma as a Reactant
4Atomic Layer Deposition of Ruthenium and Ruthenium-oxide Thin Films by Using a Ru(EtCp)2 Precursor and Oxygen Gas
5Atomic Layer Deposition of Ruthenium with TiN Interface for Sub-10 nm Advanced Interconnects beyond Copper
6Correlation of carbon content with the thermal stability of ruthenium deposited by using RF-direct plasma-enhanced atomic-layer deposition
7Development of plasma-enhanced atomic layer deposition grown Ru-WCN mixed phase films for nanoscale diffusion barrier and copper direct-plate applications
8Effects of Ar plasma treatment for deposition of ruthenium film by remote plasma atomic layer deposition
9Formation of Ru nanocrystals by plasma enhanced atomic layer deposition for nonvolatile memory applications
10Improvement of the thermal stability of nickel silicide using a ruthenium interlayer deposited via remote plasma atomic layer deposition
11In situ spectroscopic ellipsometry during atomic layer deposition of Pt, Ru and Pd
12In Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating
13Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
14Mobile setup for synchrotron based in situ characterization during thermal and plasma-enhanced atomic layer deposition
15Near room temperature plasma enhanced atomic layer deposition of ruthenium using the RuO4-precursor and H2-plasma
16Non-destructive acoustic metrology and void detection in 3x50μm TSV
17PEALD of a Ruthenium Adhesion Layer for Copper Interconnects
18Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
19Potassium Permanganate-Based Slurry to Reduce the Galvanic Corrosion of the Cu/Ru/TiN Barrier Liner Stack during CMP in the BEOL Interconnects
20Preparation of Ru thin film layer on Si and TaN/Si as diffusion barrier by plasma enhanced atomic layer deposition
21Radical Enhanced Atomic Layer Deposition of Metals and Oxides
22Reliability testing of high aspect ratio through silicon vias fabricated with atomic layer deposition barrier, seed layer and direct plating and material properties characterization of electrografted insulator, barrier and seed layer for 3-D integration
23Ru thin film grown on TaN by plasma enhanced atomic layer deposition
24Scalability of plasma enhanced atomic layer deposited ruthenium films for interconnect applications
25Structural investigation of Ru/Pt nanocomposite films prepared by plasma-enhanced atomic layer depositions
26Structure of Ru/Pt Nanocomposite Films Fabricated by Plasma-Enhanced Atomic Layer Depositions
27The Properties of Cu Thin Films on Ru Depending on the ALD Temperature
28The properties of Ru films deposited by remote plasma atomic layer deposition on Ar plasma-treated SiO2
29Thermal and plasma enhanced atomic layer deposition ruthenium and electrical characterization as a metal electrode
30Understanding the EOT-Jg degradation in Ru/SrTiOx/Ru metal-insulator-metal capacitors formed with Ru atomic layer deposition

Disclaimer

I am sure there are papers I have not found. I am sure there is an occasional typo or omission in the database entries. I have hundreds of pre-2009 papers yet to add. As a result, the information provided is not perfect and not complete. Don't blame Plasma-ALD-Guy if the use of information on this site does not work out for you. If you know of publications I have missed or a database entry is wrong, send me an email at: plasma-ald-guy@plasma-ald.com

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