Cu Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for plasma enhanced atomic layer deposition publications discussing Cu films returned 17 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1Low-Temperature Atomic Layer Deposition of High Purity, Smooth, Low Resistivity Copper Films by Using Amidinate Precursor and Hydrogen Plasma
2Plasma-enhanced atomic layer deposition of Cu–Mn films with formation of a MnSixOy barrier layer
3Metallic Copper Thin Films Grown by Plasma-Enhanced Atomic Layer Deposition of Air Stable Precursors
4Inductively Coupled Hydrogen Plasma-Assisted Cu ALD on Metallic and Dielectric Surfaces
5Low temperature hydrogen plasma-assisted atomic layer deposition of copper studied using in situ infrared reflection absorption spectroscopy
6Hydrogen plasma-enhanced atomic layer deposition of copper thin films
7Effects of Hydrogen Plasma Treatments on the Atomic Layer Deposition of Copper
8Atomic Layer Deposition of Copper Seed Layers from a (hfac)Cu(VTMOS) Precursor
9Copper-ALD Seed Layer as an Enabler for Device Scaling
10Integration of Electrochemically Deposited Cu with Plasma Enhanced Atomic Layer Deposition-Grown Cu Seed Layers
11Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
12PEALD of Copper using New Precursors for Next Generation of Interconnections
13Atomic layer deposition of copper thin film and feasibility of deposition on inner walls of waveguides
14Deposition of copper by plasma-enhanced atomic layer deposition using a novel N-Heterocyclic carbene precursor
15Island Coalescence during Film Growth: An Underestimated Limitation of Cu ALD
16Ultra-Low Temperature Deposition of Copper Seed Layers by PEALD
17Radical-Enhanced Atomic Layer Deposition of Metallic Copper Thin Films - Thesis Coverage