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Characterization of Ultrathin PEALD-Grown RuCo Films for Diffusion Barrier and Copper Direct-Plate Applications
Type:
Journal
Info:
ECS Transactions, 35 (20) 17-24 (2011)
Date:
2011-07-01
Author Information
| Name | Institution |
|---|---|
| Daniel V. Greenslit | State University of New York at Albany |
| Eric T. Eisenbraun | State University of New York at Albany |
Films
Plasma Ru
Plasma Co
Film/Plasma Properties
Characteristic: Microstructure
Analysis: TEM, Transmission Electron Microscope
Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: Electron Diffraction
Characteristic: Conformality, Step Coverage
Analysis: SEM, Scanning Electron Microscopy
Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe
Characteristic: Diffusion Barrier Properties
Analysis: TVS, Triangle Voltage Sweep
Substrates
| SiO2 |
Notes
| 1356 |