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Plasma Enhanced Atomic Layer Deposition of TaN Films for Advanced Interconnects
Type:
Conference Proceedings
Info:
ECS Transactions, 33 (2) 169-176 (2010)
Date:
2010-07-08
Author Information
| Name | Institution |
|---|---|
| Paul Ma | Applied Materials |
| Jiang Lu | Applied Materials |
| Joseph Aubuchon | Applied Materials |
| Tza-Jing Gung | Applied Materials |
| Mei Chang | Applied Materials |
Films
Film/Plasma Properties
Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe
Characteristic: Density
Analysis: XRR, X-Ray Reflectivity
Characteristic: Dewetting
Analysis: SEM, Scanning Electron Microscopy
Characteristic: Diffusion Barrier Properties
Analysis: Four-point Probe
Characteristic: Compositional Depth Profiling
Analysis: AES, Auger Electron Spectroscopy
Characteristic: Conformality, Step Coverage
Analysis: TEM, Transmission Electron Microscope
Characteristic: Morphology, Roughness, Topography
Analysis: SEM, Scanning Electron Microscopy
Substrates
| Silicon |
Notes
| Unknown direct capacitively coupled plasma. |
| 730 |