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Publication Information

Title: Non-destructive acoustic metrology and void detection in 3x50μm TSV

Type: Conference Proceedings

Info: 2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)

Date: 2016-05-16

DOI: http://dx.doi.org/10.1109/ASMC.2016.7491103

Author Information

Name

Institution

Rudolph Technologies

Rudolph Technologies

Rudolph Technologies

Rudolph Technologies

Rudolph Technologies

Rudolph Technologies

IMEC

IMEC

IMEC

IMEC

IMEC

University of Colorado, Boulder

Films

Plasma SiO2 using Unknown

Deposition Temperature Range N/A

Thermal TiN using Unknown

Deposition Temperature Range N/A

Thermal Ru using Unknown

Deposition Temperature Range N/A

Film/Plasma Properties

Characteristic

Analysis

Diagnostic

Substrates

Keywords

Notes

SiO2 is a guess at the "highly conformal Plasma Enhanced Atomic Layer Deposition (PEALD) oxide liner."

953

Disclaimer

I am sure there are papers I have not found. I am sure there is an occasional typo or omission in the database entries. I have hundreds of pre-2009 papers yet to add. As a result, the information provided is not perfect and not complete. Don't blame Plasma-ALD-Guy if the use of information on this site does not work out for you. If you know of publications I have missed or a database entry is wrong, send me an email at: plasma-ald-guy@plasma-ald.com

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